HOME
ABOUT US
- Company
- Global Markets
SUSTAINABILITY
OUR CAPABILITIES
APPLICATION
PRODUCTS
NEWS
- Company
- Exhibition
DOWNLOAD
- Catalog
CONTACT
- Get In Touch
- Location

ENGLISH
繁體中文

OUR CAPABILITIES

OUR CAPABILITIES

Home
OUR CAPABILITIES
Die Bond

Engineering Solutions
SMT
Die Bond
Wire Bond
Lens Bond

Die Bond

Accurate die placement and bonding for stable and reliable chip assembly.

Thermal Shock Tester

Thermal Shock Tester

Thermal Shock Tester

Thermal Shock Tester

TOP

ABOUT US
SUSTAINABILITY
OUR CAPABILITIES
APPLICATION
PRODUCTS
NEWS
DOWNLOAD
CONTACT

886-3-552-6165
No. 26-1, Tai-Yuen St., Chupei City, Hsinchu County 302, Taiwan

LinkedIn

Copyright © LEAP OPTICAL TECHNOLOGY CORP. All Rights Reserved.

Da-Vinci 網頁設計

This website uses third-party cookies for offering the best navigation experience. By continuing to browse this website, you consent to the use of these cookies.

ACCEPT

LEARN MORE